US 12,284,299 B2
Electronic device housing with insert molded features and methods of constructing the same
Byoungkwan Sohn, Arlington Heights, IL (US)
Assigned to Motorola Mobility LLC, Chicago, IL (US)
Filed by Motorola Mobility LLC, Chicago, IL (US)
Filed on Mar. 16, 2017, as Appl. No. 15/461,286.
Prior Publication US 2018/0270963 A1, Sep. 20, 2018
Int. Cl. G06F 1/16 (2006.01); H04M 1/02 (2006.01); B29C 45/14 (2006.01); B29K 69/00 (2006.01); B29L 31/34 (2006.01)
CPC H04M 1/0202 (2013.01) [G06F 1/1698 (2013.01); B29C 45/14639 (2013.01); B29K 2069/00 (2013.01); B29L 2031/3481 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A component for an electronic device, the component comprising:
a housing;
a plastic substrate, disposed adjacent to the housing; and
a thermoplastic overlayer, insert molded into the housing;
wherein the plastic substrate is disposed between the housing and the thermoplastic overlayer;
wherein the thermoplastic overlayer envelops all major and minor faces of the plastic substrate other than a housing interface of the plastic substrate, which is a major face of the plastic substrate abutting the housing.