US 12,283,912 B2
Infrastructureless active carrier plane (ACP)
Jeffrey Patrick Brew, Las Vegas, NV (US)
Assigned to Mavn Technology Licensing, Inc., Las Vegas, NV (US)
Filed by Jeffrey Patrick Brew, Las Vegas, NV (US)
Filed on May 30, 2023, as Appl. No. 18/325,872.
Application 18/325,872 is a continuation of application No. 17/933,476, filed on Sep. 19, 2022, granted, now 12,034,397.
Prior Publication US 2024/0097603 A1, Mar. 21, 2024
Int. Cl. H02S 20/00 (2014.01); H02S 40/30 (2014.01); H02S 40/36 (2014.01); H05K 7/14 (2006.01)
CPC H02S 20/00 (2013.01) [H02S 40/30 (2014.12); H02S 40/36 (2014.12); H05K 7/1492 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An active carrier plane of an infrastructureless data center, the active carrier plane comprising:
a plurality of module connectors, each module connector being configured to interface with a corresponding assembly connector of a module assembly of the infrastructureless data center;
a power connector, the power connector being configured to interface with a corresponding power assembly of the infrastructureless data center, the power assembly comprising a plurality of power storage components; and
circuitry comprising:
a processor that is configured to manage module assemblies connected to the plurality of module connectors;
a network component that is configured to provide inter-module communication between module assemblies connected to the plurality of module connectors; and
a power delivery component that is configured to:
manage a first supply of direct current (DC) electrical power to the power connector, the first supply of DC electrical power having been obtained based at least in part on DC electrical power output by a photovoltaic panel;
manage the first supply of DC electrical power to the plurality of module connectors; and
manage a second supply of DC electrical power from the power connector to at least one of the module connectors.