US 12,283,823 B2
Thermal transfer system and method
Robert J. Monson, Minneapolis, MN (US); and Andrew T. Fried, Minneapolis, MN (US)
Assigned to Medtronic, Inc., Minneapolis, MN (US)
Filed by Medtronic, Inc., Minneapolis, MN (US)
Filed on Aug. 4, 2021, as Appl. No. 17/393,885.
Prior Publication US 2023/0040626 A1, Feb. 9, 2023
Int. Cl. H02J 50/00 (2016.01); A61N 1/375 (2006.01); H05K 7/20 (2006.01)
CPC H02J 50/005 (2020.01) [H02J 50/00 (2016.02); H05K 7/20336 (2013.01); A61N 1/375 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for transferring thermal energy in a wireless recharger for an implantable system, comprising:
a transmitter coil configured to transmit a power transfer signal;
a power source to energize the transmitter coil to transmit the power transfer signal;
a heat sink having a first side adjacent the transmitter coil and a second opposed side and configured to absorb thermal energy from near the transmitter coil; and
a heat pipe separate from and spaced away from the transmitter coil, the heat pipe defining an internal heat pipe passage;
wherein the heat pipe includes a first portion positioned near the second opposed side to absorb thermal energy from the heat sink and a second portion positioned away from the heat sink, wherein thermal energy is transported from the first portion of the heat pipe to the second portion of the heat pipe.