US 12,283,792 B2
Light emitting device, and electronic apparatus
Kiyohisa Sakai, Kanagawa (JP); Hirohisa Yasukawa, Kanagawa (JP); and Masayuki Nagao, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/626,278
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jul. 1, 2020, PCT No. PCT/JP2020/025772
§ 371(c)(1), (2) Date Jan. 11, 2022,
PCT Pub. No. WO2021/024652, PCT Pub. Date Feb. 11, 2021.
Claims priority of application No. 2019-144174 (JP), filed on Aug. 6, 2019.
Prior Publication US 2022/0293545 A1, Sep. 15, 2022
Int. Cl. H01S 5/00 (2006.01); H01S 5/02345 (2021.01); H01S 5/024 (2006.01); H01L 23/00 (2006.01)
CPC H01S 5/02469 (2013.01) [H01S 5/02345 (2021.01); H01S 5/02438 (2013.01); H01S 5/02446 (2013.01); H01L 24/20 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/32225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light emitting device, comprising:
a first substrate;
a light source mounted on and in contact with a first surface of the first substrate, wherein the light source emits light toward an object;
a driver disposed in the first substrate, wherein the driver drives the light source, and wherein the driver overlaps the light source in a plan view;
at least one first via disposed in the first substrate, wherein the at least one first via overlaps the driver in the plan view; and
a first conductor on a second surface of the first substrate opposite the first surface, wherein the first conductor overlaps the light source, the driver, and the at least one first via in the plan view, and wherein the first conductor is connected to the at least one first via.