US 12,283,782 B2
Electronic component
Takashi Sekine, Yokohama (JP)
Assigned to IRISO ELECTRONICS CO., LTD., Yokohama (JP)
Filed by IRISO ELECTRONICS CO., LTD., Yokohama (JP)
Filed on Aug. 29, 2022, as Appl. No. 17/897,540.
Claims priority of application No. 2021-140180 (JP), filed on Aug. 30, 2021.
Prior Publication US 2023/0063034 A1, Mar. 2, 2023
Int. Cl. H01R 24/40 (2011.01); H01R 13/24 (2006.01); H01R 13/508 (2006.01); H01R 13/52 (2006.01); H01R 103/00 (2006.01)
CPC H01R 24/40 (2013.01) [H01R 13/2407 (2013.01); H01R 13/508 (2013.01); H01R 13/5202 (2013.01); H01R 2103/00 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a housing that is attached to another component to form a storage space together with the other component;
an inner conductor that extends along a first direction and electrically connects a first connection object outside the storage space and a second connection object inside the storage space;
a cylindrical outer conductor that annularly surrounds the inner conductor and extends in the first direction; and
an internal shell that is disposed inside the storage space and is electrically connected to the outer conductor,
wherein the internal shell has a spring piece that makes elastic contact with the outer conductor,
wherein the spring piece has:
a contact portion that makes contact with the outer conductor, and
an elastic support portion that supports the contact portion,
wherein the elastic support portion extends in a direction perpendicular to the first direction,
wherein when the internal shell is electrically connected to the outer conductor, the elastic support portion is in a state of elastic deformation and displaced toward the second connection object in the first direction.