US 12,283,760 B2
Radio-frequency module and communication apparatus
Koji Furutani, Kyoto (JP)
Assigned to Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Jan. 23, 2023, as Appl. No. 18/158,106.
Application 18/158,106 is a continuation of application No. PCT/JP2021/034462, filed on Sep. 21, 2021.
Claims priority of application No. 2020-164926 (JP), filed on Sep. 30, 2020.
Prior Publication US 2023/0163464 A1, May 25, 2023
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/42 (2006.01); H01Q 5/335 (2015.01)
CPC H01Q 5/335 (2015.01) [H01Q 1/2283 (2013.01); H01Q 1/422 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
a multilayer substrate including a plurality of stacked layers, the multilayer substrate having a first major face and a second major face;
a first semiconductor device;
a second semiconductor device;
a first mold layer sealing the first semiconductor device; and
a second mold layer sealing the second semiconductor device,
wherein the first major face includes a first recess,
wherein the first semiconductor device is mounted over a bottom face of the first recess,
wherein the first mold layer is disposed in the first recess,
wherein the second semiconductor device is mounted over the first major face so as to overlie the first recess,
wherein the first semiconductor device is connected with a metallic via, the metallic via extending from the bottom face of the first recess to the second major face, and
wherein the first mold layer and the second mold layer comprise different materials.