US 12,283,756 B2
Antenna array element with dual polarization, antenna array including antenna array element and electronic device including antenna array
Artem Rudolfovitch Vilenskiy, Moscow (RU); Elena Aleksandrovna Shepeleva, Moscow (RU); Gennadiy Aleksandrovich Evtyushkin, Moscow (RU); and Anton Sergeevich Lukyanov, Moscow (RU)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 2, 2023, as Appl. No. 18/177,503.
Application 18/177,503 is a continuation of application No. PCT/KR2023/002579, filed on Feb. 23, 2023.
Claims priority of application No. RU2022131923 (RU), filed on Dec. 7, 2022.
Prior Publication US 2024/0195085 A1, Jun. 13, 2024
Int. Cl. H01Q 25/00 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 25/001 (2013.01) [H01Q 21/065 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An antenna array element with dual polarization, comprising:
a multilayer printed circuit board (PCB);
a first patch placed on an inner layer of the multilayer PCB;
a second patch placed on an upper layer of the multilayer PCB and coupled by electromagnetic field with the first patch;
two U slots placed orthogonally on the multilayer PCB under the first patch, wherein each of the U slots includes a first line part, a second line part placed parallel to the first line part, and a third line part connecting the first line part and the second line part, and each of the first line part, the second line part, and the third line part is tilted by 45 degrees with respect to at least one side of the antenna array element;
feedlines placed on one PCB layer under the U slots orthogonally to each other and configured to excite the U slots;
a plurality of electromagnetic band gap (EBG) elements located in a boundary area of the antenna array element; and
a plurality of decoupling plated through holes (VIAs) located symmetrically according to symmetry of the antenna array element, around the feedlines.