US 12,283,752 B2
Frequency re-configurable orbital angular momentum (OAM) antenna with in S band and frequency reconfiguration method
Zhixiang Huang, Hefei (CN); Sixian Qian, Hefei (CN); Jie Wu, Hefei (CN); Kaikun Niu, Hefei (CN); Yi Li, Hefei (CN); Shuyang An, Hefei (CN); Xingang Ren, Hefei (CN); Lixia Yang, Hefei (CN); and Xianliang Wu, Hefei (CN)
Assigned to Anhui University, Hefei (CN)
Filed by Anhui University, Hefei (CN)
Filed on Dec. 22, 2022, as Appl. No. 18/145,148.
Claims priority of application No. 202210385152.2 (CN), filed on Apr. 13, 2022.
Prior Publication US 2023/0335920 A1, Oct. 19, 2023
Int. Cl. H01Q 21/20 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 21/20 (2013.01) [H01Q 9/0414 (2013.01); H01Q 9/0442 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A frequency re-configurable orbital angular momentum (OAM) antenna in S band, comprising: a lower dielectric substrate and multiple array units, wherein
each of an upper surface and a lower surface of the lower dielectric substrate is provided with a metal copper clad region and a bare region; and the multiple array units are uniformly distributed in the bare region of the upper surface of the lower dielectric substrate in a circular array; and
each array unit comprises:
a metal patch, fixed in the bare region of the upper surface of the lower dielectric substrate;
an upper dielectric substrate, disposed opposite to the metal patch, wherein an air-layer space is formed between the upper dielectric substrate and the metal patch; and an upper surface of the upper dielectric substrate is provided with a metal copper clad region and a bare region;
an outer loop, fixed in the bare region of the upper dielectric substrate;
an inner loop, fixed in the outer loop;
a coaxial feeder, fixed in the lower dielectric substrate, wherein one end of the coaxial feeder is connected to the metal patch; and the other end of the coaxial feeder is connected to the metal copper clad region of the lower surface of the lower dielectric substrate;
four metal probes, fixed in the lower dielectric substrate, wherein one end of each metal probe is connected to the metal patch; and
four diodes, fixed in the bare region of the lower surface of the lower dielectric substrate, wherein one end of each diode is connected to a metal probe at a corresponding position; and the other end of the diode is connected to the metal copper clad region of the lower surface of the lower dielectric substrate.