US 12,283,585 B2
Optoelectronic device package and method of manufacturing the same
Chi-Han Chen, Taoyuan (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Feb. 6, 2024, as Appl. No. 18/434,703.
Application 18/434,703 is a continuation of application No. 17/319,948, filed on May 13, 2021, granted, now 11,894,354.
Prior Publication US 2024/0213233 A1, Jun. 27, 2024
Int. Cl. H01L 25/16 (2023.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01)
CPC H01L 25/167 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/214 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An optoelectronic device package, comprising:
a first redistribution layer (RDL);
a processing die disposed over the first RDL;
a first electronic component disposed over the first RDL and electrically connected to the processing die through the first RDL;
a second electronic component disposed over the first RDL,
wherein the first electronic component is disposed between the processing die and the second electronic component, and an edge of the first RDL protrudes out of an outer edge of the second electronic component in a direction away from the first electronic component; and
a photonic die disposed over the second electronic component, wherein a level of an upper surface of the photonic die is higher than a level of an upper surface of the processing die with respect to the first RDL.