US 12,283,577 B2
Fan-out semiconductor package
Joonsung Kim, Suwon-si (KR); and Seokwon Lee, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jul. 12, 2022, as Appl. No. 17/862,482.
Claims priority of application No. 10-2021-0176943 (KR), filed on Dec. 10, 2021.
Prior Publication US 2023/0187424 A1, Jun. 15, 2023
Int. Cl. H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2023.01); H01L 49/02 (2006.01)
CPC H01L 25/16 (2013.01) [H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 25/162 (2013.01); H01L 28/90 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 24/48 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/08265 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/182 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A fan-out semiconductor package comprising:
a package body including a fan-in area corresponding to a through-hole located therein, a fan-out area surrounding the fan-in area, and a body interconnect structure arranged in the package body corresponding to the fan-out area;
a fan-in chip structure located in the through-hole, the fan-in chip structure including a first chip, a capacitor chip arranged to be spaced apart from the first chip, and a second chip disposed on both the first chip and the capacitor chip;
a redistribution structure arranged on a bottom surface of the package body and a bottom surface of the fan-in chip structure and including a redistribution element extending to the fan-out area; and
an interconnect via arranged on a top surface of the package body and electrically connected to the redistribution element in the fan-out area.