US 12,283,576 B2
Electronic device including thermal interface material layer and semiconductor package
Yongha Kim, Seongnam-si (KR); Bonggyu Kang, Yongin-si (KR); and Youngsoo Jang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 5, 2022, as Appl. No. 17/713,309.
Claims priority of application No. 10-2021-0063200 (KR), filed on May 17, 2021.
Prior Publication US 2022/0367428 A1, Nov. 17, 2022
Int. Cl. H01L 25/10 (2006.01)
CPC H01L 25/105 (2013.01) [H01L 2225/1094 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate having a first surface and a second surface that are opposite to each other;
a first plate having a first internal surface facing the first surface of the substrate, and a first external surface that is opposite to the first internal surface, the first plate including at least one first through-hole and at least one second through-hole;
a first semiconductor package and a second semiconductor package on the first surface of the substrate, the first semiconductor package and the second semiconductor package being between the first surface of the substrate and the first internal surface of the first plate, and the first semiconductor package and the second semiconductor package being spaced apart from each other;
a first thermal interface material layer between the first semiconductor package and the first plate, the first thermal interface material layer contacting an upper surface of the first semiconductor package and the first internal surface of the first plate, and the first thermal interface material layer filling at least a portion of the at least one first through-hole; and
a second thermal interface material layer between the second semiconductor package and the first plate, the second thermal interface material layer contacting an upper surface of the second semiconductor package and the first internal surface of the first plate, and the second thermal interface material layer filling at least a portion of the at least one second through-hole,
wherein at least one of a side surface of the first thermal interface material layer and a side surface of the second thermal interface material layer is exposed to an empty space between the first internal surface of the first plate and the first surface of the substrate.