CPC H01L 25/0652 (2013.01) [H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01L 25/50 (2013.01)] | 14 Claims |
1. A semiconductor device package, comprising:
a first substrate having a first surface and a second surface opposite to the first surface;
a second substrate disposed over the first surface of the first substrate; and
an encapsulant covering the first surface and the second surface of the first substrate,
wherein a portion of the second surface of the first substrate is exposed from the encapsulant,
wherein the encapsulant includes a first portion disposed in a gap between the first surface of the first substrate and a lower surface of the second substrate, wherein the gap vertically overlaps the first substrate and the second substrate in a cross-sectional view,
wherein the first substrate has a first lateral surface substantially aligned with a lateral surface of the second substrate.
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