US 12,283,561 B2
Flexible electronic structure
Brian Cobb, Sedgefield Durham (GB); and Richard Price, Sedgefield Durham (GB)
Assigned to PRAGMATIC SEMICONDUCTOR LIMITED, Cambridge (GB)
Appl. No. 17/611,604
Filed by PRAGMATIC SEMICONDUCTOR LIMITED, Cambridge (GB)
PCT Filed May 19, 2020, PCT No. PCT/GB2020/051219
§ 371(c)(1), (2) Date Nov. 16, 2021,
PCT Pub. No. WO2020/234581, PCT Pub. Date Nov. 26, 2020.
Claims priority of application No. 1907158 (GB), filed on May 21, 2019.
Prior Publication US 2022/0246500 A1, Aug. 4, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H05K 1/18 (2006.01)
CPC H01L 24/19 (2013.01) [H01L 23/367 (2013.01); H01L 23/4985 (2013.01); H01L 23/5225 (2013.01); H01L 23/562 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/20 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 1/181 (2013.01); H01L 24/81 (2013.01); H01L 24/82 (2013.01); H01L 2224/03318 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/16268 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32268 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81898 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A flexible electronic structure for bonding with an external circuit, comprising:
a flexible substrate, having a first surface, configured for bonding with the external circuit, and an opposing second surface, configured for engagement with a bonding tool, wherein the flexible substrate comprises at least one embedded component;
at least one contact member, operatively coupled with said at least one embedded electronic component and provided at said first surface of said flexible substrate, and adapted to operably interface with the external circuit after bonding, and
at least one mechanical shield member, the at least one mechanical shield member provided at said first surface, the at least one mechanical shield member located between the external circuit and the at least one embedded component during bonding, the at least one mechanical shield member having an overlapping footprint with at least a portion of the at least one embedded component.