US 12,283,550 B2
Electronic apparatus and method of manufacturing the same
Dong Hwan Kim, Seongnam-si (KR); Hee Chang Park, Suwon-si (KR); Jeong Jin Kim, Cheonan-si (KR); Jinkyu Kim, Cheongju-si (KR); and Moo-Hyun Jo, Seoul (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Sep. 11, 2023, as Appl. No. 18/244,556.
Application 18/244,556 is a continuation of application No. 16/943,035, filed on Jul. 30, 2020, granted, now 11,756,895.
Claims priority of application No. 10-2019-0101861 (KR), filed on Aug. 20, 2019.
Prior Publication US 2023/0420385 A1, Dec. 28, 2023
Int. Cl. H01L 23/552 (2006.01); H01L 21/52 (2006.01); H01L 23/544 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/544 (2013.01); H01L 2223/54433 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a display assembly, the method comprising:
mounting a driving chip on a display circuit board;
disposing a shield-can on the display circuit board, the shield-can including a top surface configured to cover the driving chip and parallel to the display circuit board and a side surface extending in a direction from the top surface to the display circuit board;
attaching a first film which has an opening that exposes a part of the top surface of the shield-can to the top surface of the shield-can;
attaching a second film onto the shield-can to which the first film is attached;
removing the second film; and
forming an identification mark on the top surface of the shield-can exposed by the opening of the first film.