US 12,283,541 B2
Manufacturing method of semiconductor package
Chi-Ming Huang, Changhua County (TW); Ping-Kang Huang, Chiayi (TW); Sao-Ling Chiu, Hsinchu (TW); and Shang-Yun Hou, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jan. 14, 2024, as Appl. No. 18/412,583.
Application 18/412,583 is a division of application No. 17/827,980, filed on May 30, 2022, granted, now 11,916,009.
Application 17/827,980 is a continuation of application No. 16/830,284, filed on Mar. 26, 2020, granted, now 11,373,946, issued on Jun. 28, 2022.
Prior Publication US 2024/0153861 A1, May 9, 2024
Int. Cl. H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/49861 (2013.01) [H01L 21/4846 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A manufacturing method of a semiconductor package, comprising:
providing an interposer;
providing semiconductor dies and bonding the semiconductor dies to a mounting surface of the interposer;
forming pre-cut lanes in the interposer;
forming a molding compound over the interposer to encapsulate the semiconductor dies to form a molded structure, wherein forming a molding compound over the interposer includes forming a first portion of the molding compound on the mounting surface to cover the semiconductor dies and forming a second portion of the molding compound on a surface of the interposer opposite to the mounting surface;
performing a singulation process to the molded structure by cutting through the molding compound and cutting through the interposer at the pre-cut lanes to form semiconductor packages;
bonding at least one package of the semiconductor packages to a circuit substrate; and
forming an underfill between the interposer, the molding compound and the circuit substrate.