US 12,283,539 B2
Semiconductor device
Yuki Matsutaka, Tokyo (JP); and Hitoshi Makishima, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Jun. 9, 2022, as Appl. No. 17/806,205.
Claims priority of application No. 2021-143130 (JP), filed on Sep. 2, 2021.
Prior Publication US 2023/0063024 A1, Mar. 2, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 23/495 (2006.01); H01L 25/11 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 23/367 (2013.01); H01L 23/4006 (2013.01); H01L 25/115 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4056 (2013.01); H01L 23/49575 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A semiconductor device connectable with semiconductor devices arranged on laterally opposite sides thereof, the semiconductor device comprising:
a semiconductor element to allow a current to flow from a source to a drain upon input of a signal from a gate;
a sealing resin to seal the semiconductor element, the sealing resin being rectangular in top view;
a gate terminal electrically connected to the gate, and protruding from a first side of the sealing resin in top view;
a drain terminal electrically connected to the drain, and protruding from the first side of the sealing resin in top view;
a source terminal electrically connected to the source, and protruding from the first side of the sealing resin in top view;
a first heat dissipation plate electrically connected to the drain, and protruding from a second side intersecting with the first side of the sealing resin in top view; and
a second heat dissipation plate electrically connected to the drain, and protruding from a third side opposing the second side of the sealing resin in top view, wherein
at least a height position of a lower surface of a distal end portion of the first heat dissipation plate and a height position of an upper surface of a proximal end portion of the second heat dissipation plate or a height position of a lower surface of a distal end portion of the second heat dissipation plate and a height position of an upper surface of a proximal end portion of the first heat dissipation plate are the same,
the first heat dissipation plate and the second heat dissipation plate protrude from the same height position of the sealing resin,
the distal end portion of the first heat dissipation plate includes a first planar portion,
the proximal end portion of the second heat dissipation plate includes a second planar portion,
the first planar portion is provided through a portion bent laterally from the proximal end portion of the first heat dissipation plate protruding from the sealing resin and extending upward, and
a height position of a lower surface of the first planar portion and a height position of an upper surface of the second planar portion are the same.