US 12,283,522 B2
Planarization apparatus, planarization process, and method of manufacturing an article
Seth J. Bamesberger, Austin, TX (US); Ozkan Ozturk, Round Rock, TX (US); Christopher Ellis Jones, Austin, TX (US); and Se-Hyuk Im, Austin, TX (US)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Nov. 10, 2022, as Appl. No. 18/054,487.
Application 18/054,487 is a continuation of application No. 16/779,205, filed on Jan. 31, 2020, granted, now 11,562,924.
Prior Publication US 2023/0061361 A1, Mar. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/76 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/7684 (2013.01) [H01L 21/32115 (2013.01); H01L 21/67253 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A superstrate for planarizing a formable material on a substrate, wherein the superstrate is held by a chuck comprising a plurality of lands defining a central zone and a peripheral zone surrounding the central zone, the superstrate comprising:
a first side and a second side opposite to the first side;
an outermost edge; and
a mesa formed on the first side, wherein an edge of the mesa is positioned inside from the outermost edge, and wherein the mesa has a planar contact surface to be in contact with the formable material on the substrate;
wherein the second side has a central portion and a peripheral portion surrounding the central portion, and the peripheral portion includes a surface depressed in such a way as to form a step with respect to the central portion, and
wherein the depressed surface of the superstrate held by the chuck has a contact surface to be in contact with an outer land among the plurality of lands of the chuck.