US 12,283,511 B2
Member for semiconductor manufacturing apparatus
Masaki Ishikawa, Handa (JP); Tatsuya Kuno, Nagoya (JP); and Taro Usami, Kakamigahara (JP)
Assigned to NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK INSULATORS, LTD., Nagoya (JP)
Filed on Apr. 19, 2023, as Appl. No. 18/302,981.
Application 18/302,981 is a continuation of application No. PCT/JP2022/041481, filed on Nov. 8, 2022.
Prior Publication US 2024/0153809 A1, May 9, 2024
Int. Cl. B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/67103 (2013.01); B32B 43/006 (2013.01); Y10T 156/1153 (2015.01); Y10T 156/1911 (2015.01)] 6 Claims
OG exemplary drawing
 
1. A member for a semiconductor manufacturing apparatus, the member comprising:
a ceramic plate that is formed of a ceramic material and has a wafer placement portion on its upper surface;
a composite plate that is formed of a composite material and joined to a lower surface of the ceramic plate;
a cooling plate that is formed of a metal material, disposed on a lower surface of the composite plate, and includes a refrigerant flow path;
a first fastener that fastens the composite plate and the cooling plate together;
a support plate that is formed of an insulating material and supports a lower surface of the cooling plate; and
a second fastener that fastens the cooling plate and the support plate together,
wherein, when the ceramic plate is heated from room temperature to high temperature, a first layered body including the ceramic plate and the composite plate deforms such that a central portion of the first layered body is convex, and a second layered body including the cooling plate and the support plate fastened together using the second fastener deforms such that a central portion of the second layered body is convex.