US 12,283,510 B2
Substrate treating apparatus and substrate treating method using the same
Sang Oh Kim, Seoul (KR); and Myung Jin Lee, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on May 18, 2022, as Appl. No. 17/747,914.
Claims priority of application No. 10-2021-0162028 (KR), filed on Nov. 23, 2021.
Prior Publication US 2023/0163009 A1, May 25, 2023
Int. Cl. H01L 21/68 (2006.01); B65G 47/90 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/681 (2013.01) [B65G 47/90 (2013.01); H01L 21/67742 (2013.01); H01L 21/68707 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate comprising:
a process chamber having a treating space therein;
a transfer robot comprising a robot hand for loading and unloading a substrate into and out of the treating space and gripping the substrate; and
a teaching buffer for aligning the robot hand,
wherein the teaching buffer comprises a teaching plate for providing a reference point, and at least one camera looking at the teaching plate,
wherein the camera captures the reference point of the teaching plate,
wherein the transfer robot aligns the robot hand with the reference point in a same line perpendicular to the teaching plate using the camera, and
wherein the reference point is captured at a first position, and the robot hand is aligned in the first position.