US 12,283,501 B2
Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and recording medium
Takayuki Ota, Toyama (JP)
Assigned to KOKUSAI ELECTRIC CORPORATION, Tokyo (JP)
Filed by KOKUSAI ELECTRIC CORPORATION, Tokyo (JP)
Filed on Jun. 17, 2022, as Appl. No. 17/843,606.
Claims priority of application No. 2021-138905 (JP), filed on Aug. 27, 2021.
Prior Publication US 2023/0068123 A1, Mar. 2, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67259 (2013.01) [H01L 21/67276 (2013.01); H01L 21/68764 (2013.01); H01L 21/68792 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising a transfer device that transfers an object,
the transfer device comprising:
(a) a motor;
(b) a drive circuit of the motor;
(c) an encoder configured to detect a rotation angle of an output shaft of the motor;
(d) a drive system configured to transmit motion of the output shaft of the motor to the object;
(e) an origin sensor configured to detect that a predetermined site of the drive system interlocked with the object has reached a predetermined position;
(f) a servo amplifier including the drive circuit and configured to hold a current position of the object based on detection by the encoder and the origin sensor and to control the object such that the object is located at a target position;
(g) an absolute position holder configured to acquire an absolute position of the predetermined site based on detection by the encoder at least while the drive circuit is turned off; and
(h) a controller configured to be bidirectionally communicable with the servo amplifier and configured to be capable of resuming servo control with the absolute position recorded in the absolute position holder as a current position of the predetermined site when the drive circuit is turned on.