US 12,283,500 B2
Methods and systems for temperature control for a substrate
Paul Zachary Wirth, Kalispell, MT (US); Kiyki-Shiy Shang, Mountain House, CA (US); and Mikhail Taraboukhine, Pleasanton, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed on Apr. 12, 2024, as Appl. No. 18/634,628.
Application 18/634,628 is a continuation of application No. 18/093,763, filed on Jan. 5, 2023, granted, now 11,984,333.
Application 18/093,763 is a continuation of application No. 16/867,362, filed on May 5, 2020, granted, now 11,551,951, issued on Jan. 10, 2023.
Prior Publication US 2024/0258140 A1, Aug. 1, 2024
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67248 (2013.01) [H01L 21/67017 (2013.01); H01L 21/67103 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
supplying a direct current (DC) power to a heating element embedded into a substrate support assembly;
measuring a voltage across the heating element and a current through the heating element as the DC power is supplied to the heating element;
determining a resistance of the heating element based on the measured voltage and the measured current;
obtaining a temperature measurement for at least one of the heating element or a zone that includes the heating element as the DC power is supplied to the heating element, wherein the temperature measurement is obtained based on one or more signals of a temperature sensor;
updating a temperature model based on the determined resistance of the heating element and the obtained temperature measurement; and
controlling, based on the updated temperature model and during a substrate process, a temperature of at least one of:
the heating element embedded in a substrate support assembly, or
an additional heating element embedded in the substrate support assembly or embedded in an additional substrate support assembly.