US 12,283,492 B2
Photonic integrated package and method forming same
Chen-Hua Yu, Hsinchu (TW); An-Jhih Su, Taoyuan (TW); and Wei-Yu Chen, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jan. 2, 2024, as Appl. No. 18/401,811.
Application 18/401,811 is a continuation of application No. 18/064,667, filed on Dec. 12, 2022, granted, now 11,901,196.
Application 18/064,667 is a continuation of application No. 17/020,245, filed on Sep. 14, 2020, granted, now 11,527,419, issued on Dec. 13, 2022.
Application 17/020,245 is a continuation of application No. 16/290,028, filed on Mar. 1, 2019, granted, now 10,777,430, issued on Sep. 15, 2020.
Claims priority of provisional application 62/690,770, filed on Jun. 27, 2018.
Prior Publication US 2024/0136203 A1, Apr. 25, 2024
Int. Cl. H01L 23/00 (2006.01); G02B 6/122 (2006.01); G02B 6/136 (2006.01); G02B 6/30 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01)
CPC H01L 21/561 (2013.01) [G02B 6/1225 (2013.01); G02B 6/136 (2013.01); G02B 6/30 (2013.01); H01L 23/3121 (2013.01); H01L 23/3171 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2924/1433 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure comprising:
an encapsulant;
a photonic die in the encapsulant;
a through-via in the encapsulant;
an electronic die over and bonding to the photonic die and the through-via;
redistribution lines underlying the encapsulant, wherein the redistribution lines are electrically connected to the electronic die, and wherein the redistribution lines are electrically coupled to the photonic die through the electronic die and the through-via;
an optical coupler attached to the photonic die; and
an optical fiber attached to the optical coupler.