US 12,283,491 B2
Method for producing singulated encapsulated components
Gerald Mittendorfer, Stuben (AT); and Friedrich Paul Lindner, Schärding (AT)
Assigned to EV GROUP E. THALLNER GMBH, St. Florian am Inn (AT)
Appl. No. 17/781,977
Filed by EV Group E. Thallner GmbH, St. Florian am Inn (AT)
PCT Filed Dec. 19, 2019, PCT No. PCT/EP2019/086421
§ 371(c)(1), (2) Date Jun. 2, 2022,
PCT Pub. No. WO2021/121608, PCT Pub. Date Jun. 24, 2021.
Prior Publication US 2023/0015545 A1, Jan. 19, 2023
Int. Cl. H01L 21/52 (2006.01); H01L 21/78 (2006.01)
CPC H01L 21/52 (2013.01) [H01L 21/78 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for producing singulated encapsulated components, said method comprising:
application of a frame structure on a substrate surface of a substrate, wherein the frame structure surrounds components arranged on the substrate surface;
bonding of a cover substrate on the frame structure;
hardening of the frame structure; and
singulation of the encapsulated components,
wherein the frame structure is formed from an adhesive,
wherein the singulated encapsulated components are treated with plasma and/or reactive gas, wherein the plasma and/or gas treatment is conducted after the hardening of the frame structure, and wherein the plasma and/or gas treatment leads to a chemical conversion of an outer surface of the frame structure.