US 12,283,433 B2
Multilayered electronic component and method of manufacturing the same
Jae Hoon Jeong, Suwon-si (KR); Hyun Woong Na, Suwon-si (KR); and Yun Jeong Cha, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 8, 2024, as Appl. No. 18/599,856.
Application 18/599,856 is a continuation of application No. 17/460,893, filed on Aug. 30, 2021, granted, now 11,955,286.
Claims priority of application No. 10-2020-0155173 (KR), filed on Nov. 19, 2020.
Prior Publication US 2024/0266117 A1, Aug. 8, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/30 (2006.01); C04B 35/468 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [C04B 35/468 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1218 (2013.01); C04B 2235/652 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a dielectric layer, and an internal electrode alternately disposed with the dielectric layer; and
an external electrode disposed on the body and connected to the internal electrode,
wherein a composite layer containing Sn and Ni is disposed at an interface between the internal electrode and the dielectric layer,
wherein the internal electrode comprises an interface portion between the composite layer and a central portion of the internal electrode,
wherein a Sn concentration of the composite layer is 5 times or more of a Sn concentration of the central portion,
wherein the internal electrode comprises a ceramic additive.