| CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01)] | 13 Claims |

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1. A multilayer ceramic electronic component comprising:
a ceramic body including a dielectric layer and first and second internal electrodes disposed to be alternately stacked with the dielectric layer interposed therebetween;
a first external electrode disposed on a first surface of the ceramic body and connected to the first internal electrode of the ceramic body; and
a second external electrode disposed on a second surface of the ceramic body and connected to the second internal electrode, the second surface being opposite the first surface in a first direction,
wherein the first external electrode includes a first base electrode layer contacting the first internal electrode, having a metal, disposed in contact with the ceramic body, and a first glass layer disposed on the first base electrode layer, and
the second external electrode includes a second base electrode layer contacting the second internal electrode, having a metal, disposed in contact with the ceramic body, and a second glass layer disposed on the second base electrode layer,
wherein each of the first and second base electrode layers have a metal coating layer randomly disposed thereon and within the corresponding first and second glass layers.
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