US 12,283,426 B2
Electronic component
Mina Hyun, Suwon-si (KR); Beomjoon Cho, Suwon-si (KR); Hyeok Jin Park, Suwon-si (KR); and Won Young Jang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 1, 2022, as Appl. No. 17/978,654.
Claims priority of application No. 10-2022-0003894 (KR), filed on Jan. 11, 2022.
Prior Publication US 2023/0223192 A1, Jul. 13, 2023
Int. Cl. H01G 2/02 (2006.01); H01G 4/228 (2006.01); H01G 4/30 (2006.01)
CPC H01G 2/02 (2013.01) [H01G 4/228 (2013.01); H01G 4/30 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a multilayer capacitor including a capacitor body, and an external electrode disposed on one surface of the capacitor body;
a frame terminal disposed outside the external electrode; and
a conductive bonding portion disposed between the external electrode and the frame terminal,
wherein an area in which the conductive bonding portion contacts the frame terminal is larger than an area in which the conductive bonding portion contacts the external electrode,
an empty space is disposed between the conductive bonding portion and the external electrode.