US 12,283,408 B2
Thick film resistor paste, thick film resistor, and electronic component
Masaki Ando, Ome (JP)
Assigned to SUMITOMO METAL MINING CO., LTD., Tokyo (JP)
Appl. No. 17/922,110
Filed by SUMITOMO METAL MINING CO., LTD., Tokyo (JP)
PCT Filed Apr. 30, 2021, PCT No. PCT/JP2021/017299
§ 371(c)(1), (2) Date Oct. 28, 2022,
PCT Pub. No. WO2021/221173, PCT Pub. Date Nov. 4, 2021.
Claims priority of application No. 2020-081114 (JP), filed on May 1, 2020.
Prior Publication US 2023/0170114 A1, Jun. 1, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01C 17/065 (2006.01); H01C 7/00 (2006.01)
CPC H01C 17/0654 (2013.01) [H01C 7/003 (2013.01)] 4 Claims
 
1. A thick film resistor paste, characterized by kneading:
a lead-ruthenate-containing glass powder that does not contain a ruthenium oxide; and
an organic vehicle,
wherein the lead-ruthenate-containing glass powder comprises 10 mass % or more and 70 mass % or less of lead ruthenate relative to 100 mass % of the glass composition containing the lead ruthenate;
wherein a glass composition of the lead-ruthenate-containing glass powder comprises 3 mass % or more and 60 mass % or less of silicon oxide, 30 mass % or more and 90 mass % or less of lead oxide, and 5 mass % or more and 50 mass % or less of boron oxide relative to 100 mass % of glass components; and
wherein a combined amount of silicon oxide, lead oxide and boron oxide by mass % is 50 mass % or more relative to 100 mass % of the glass components.