US 12,283,335 B2
Storage device suitable for high temperature
Chin Feng Chang, New Taipei (TW); Hsun Chia Ma, New Taipei (TW); and Wei Hsiang Wang, New Taipei (TW)
Assigned to TEAM GROUP INC., New Taipei (TW)
Filed by TEAM GROUP INC., New Taipei (TW)
Filed on Jun. 15, 2023, as Appl. No. 18/210,099.
Claims priority of application No. 112115624 (TW), filed on Apr. 26, 2023.
Prior Publication US 2024/0363151 A1, Oct. 31, 2024
Int. Cl. G11C 7/04 (2006.01)
CPC G11C 7/04 (2013.01) 10 Claims
OG exemplary drawing
 
1. A storage device suitable for high temperature, comprising:
a substrate;
a plurality of memory devices, disposed on the top of said substrate, respectively;
a control device, disposed on the top of said substrate, and connected electrically to said plurality of memory devices for transmitting a storage signal; and
a temperature sensor, disposed on the top of said substrate and connected electrically to said control device, including a first predetermined temperature, a second predetermined temperature, and a third predetermined temperature, used for sensing the temperature of said plurality of memory devices and generating a temperature value, said control device lowering said storage signal to a first transmission rate if said temperature value is greater than said first predetermined temperature and smaller than said second predetermined temperature, said control device lowering said storage signal to a second transmission rate if said temperature value is greater than said second predetermined temperature, and said control device lowering said storage signal to a third transmission rate if said temperature value is greater than said third predetermined temperature.