US 12,283,248 B1
Circuitry structure and display substrate
Chengyuan Luo, Beijing (CN); Pan Xu, Beijing (CN); Ying Han, Beijing (CN); Donghui Zhao, Beijing (CN); Guangshuang Lv, Beijing (CN); Xing Zhang, Beijing (CN); Miao Liu, Beijing (CN); Xing Yao, Beijing (CN); and Cheng Xu, Beijing (CN)
Assigned to BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 18/577,444
Filed by BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Mar. 29, 2023, PCT No. PCT/CN2023/084778
§ 371(c)(1), (2) Date Jan. 8, 2024,
PCT Pub. No. WO2024/197652, PCT Pub. Date Oct. 3, 2024.
Int. Cl. G09G 3/3266 (2016.01); H10K 59/131 (2023.01)
CPC G09G 3/3266 (2013.01) [H10K 59/131 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A circuitry structure, comprising a base substrate, and a functional transistor and a signal transmission line arranged on the base substrate, wherein the functional transistor comprises a first conductive connection member, a first electrode, a second electrode, at least two gate electrode patterns and at least one active pattern; an orthogonal projection of the first electrode onto the base substrate at least partially overlaps with an orthogonal projection of the active pattern onto the base substrate, and an orthogonal projection of the second electrode onto the base substrate at least partially overlaps with the orthogonal projection of the active pattern onto the base substrate;
orthogonal projections of the at least two gate electrode patterns onto the base substrate at least partially overlap with the orthogonal projection of the active pattern onto the base substrate, first ends of the at least two gate electrode patterns are coupled to each other, and the at least two gate electrode patterns form a non-closed loop structure on a film layer where the at least two gate electrode patterns are located;
the first conductive connection member is arranged at a layer different from the gate electrode pattern and coupled to second ends of the at least two gate electrode patterns; and
the signal transmission line is coupled to the first conductive connection member.