CPC G06F 3/0412 (2013.01) [G06F 3/04164 (2019.05); H10K 59/131 (2023.02); H10K 59/40 (2023.02); H10K 59/873 (2023.02); H10K 2102/311 (2023.02)] | 19 Claims |
1. A touch display panel, comprising a display area and a non-display area, wherein the touch display panel further comprises:
a substrate;
a thin film transistor array layer disposed on the substrate and comprising a plurality of thin film transistors;
an organic light emitting layer disposed in the display area and disposed on a side of the thin film transistors away from the substrate; and
a touch function layer disposed on a side of the organic light emitting layer away from the substrate, wherein the touch function layer comprises a touch electrode and a touch trace that are electrically connected, the touch electrode is disposed in the display area, and the touch trace extends along the display area to the non-display area; and
wherein the thin film transistor array layer further comprises a first metal layer, the first metal layer comprises a first wiring disposed in the display area and a touch wiring disposed in the non-display area, the first wiring is electrically connected to the thin film transistor, and the touch wiring and the touch trace are electrically connected in the non-display area;
wherein the non-display area comprises a first sub-bezel area, a bending area, and a second sub-bezel area that are sequentially arranged, and the first sub-bezel area is disposed between the display area and the bending area;
wherein the touch display panel further comprises:
a retaining wall disposed on a side of the thin film transistor array layer away from the substrate and disposed on the non-display area; and
an encapsulation layer disposed between the organic light emitting layer and the touch function layer, wherein the encapsulation layer covers the light emitting layer in the display area and extends to cover the retaining wall in the non-display area; and
wherein the touch trace and the touch wiring are electrically connected through a via hole, and the via hole is formed between the retaining wall and the bending area.
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