US 12,282,256 B2
Photoresist deposition using independent multichannel showerhead
Farzad Houshmand, Mountain View, CA (US); Wayne French, San Jose, CA (US); Anantha Subramani, San Jose, CA (US); Kelvin Chan, San Ramon, CA (US); Lakmal Charidu Kalutarage, San Jose, CA (US); and Mark Joseph Saly, Milpitas, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 22, 2021, as Appl. No. 17/508,291.
Claims priority of provisional application 63/114,940, filed on Nov. 17, 2020.
Prior Publication US 2022/0155689 A1, May 19, 2022
Int. Cl. G03F 7/16 (2006.01)
CPC G03F 7/167 (2013.01) 18 Claims
OG exemplary drawing
 
1. A method of depositing a photoresist onto a substrate in a processing chamber, comprising:
flowing an oxidant into the processing chamber through a first path in a showerhead; and
flowing an organometallic into the processing chamber through a second path in the showerhead, wherein the first path is isolated from the second path so that the oxidant and the organometallic do not mix within the showerhead, and wherein one of the first path or the second path is along an upstream surface of the showerhead, and the other one of first path or the second path is along a sidewall surface of the showerhead; and
wherein the oxidant and the organometallic react in the processing chamber to deposit the photoresist on the substrate.