US 12,282,075 B2
Sensor package and system
Simon E. Rock, Heidelberg (DE); Georges El Bacha, Manchester, NH (US); Shaun D. Milano, Charlestown, NH (US); Loïc André Messier, Vanzy (FR); Alexander Latham, Harvard, MA (US); Maxwell McNally, Manchester, NH (US); and Shixi Louis Liu, Hooksett, NH (US)
Assigned to Allegro MicroSystems, LLC, Manchester, NH (US)
Filed by Allegro MicroSystems, LLC, Manchester, NH (US)
Filed on Jul. 1, 2022, as Appl. No. 17/810,353.
Prior Publication US 2024/0003995 A1, Jan. 4, 2024
Int. Cl. G01R 33/06 (2006.01); G01R 19/00 (2006.01); H05K 1/18 (2006.01)
CPC G01R 33/06 (2013.01) [G01R 19/0092 (2013.01); H05K 1/181 (2013.01); H05K 2201/10151 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A current sensor integrated circuit comprising:
a lead frame comprising a die attach pad and a plurality of elongated leads extending in a single direction with respect to the die attach pad;
a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting a plurality of magnetic field sensing elements; and
a non-conductive mold material enclosing the semiconductor die and the die attach pad of the lead frame,
wherein a first portion of the non-conductive mold material encloses the semiconductor die and the die attach pad of the lead frame and wherein a second portion of the non-conductive mold material encloses a portion of the elongated leads, wherein the non-conductive mold material further comprises a wing structure between the first portion and the second portion, and
wherein each of the plurality of magnetic field sensing elements is configured to sense a magnetic field generated by a current through a bus bar having a first major surface, a second opposing major surface, and a cutout extending through the bus bar from the first major surface to the second major surface, wherein the first portion of the non-conductive mold material extends into the cutout.