US 12,282,053 B1
Hybrid circuit board
Mark Bates, Lansdale, PA (US); James Edelen, Lansdale, PA (US); Robert Bauerle, Lansdale, PA (US); Michael Robert Ladd, Lansdale, PA (US); and David L. Barrett, Lansdale, PA (US)
Assigned to Cobham Advanced Electronic Solutions Inc., Arlington, VA (US)
Filed by Cobham Advanced Electronic Solutions Inc., Arlington, VA (US)
Filed on Oct. 10, 2022, as Appl. No. 18/045,299.
Int. Cl. G01R 31/28 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 3/32 (2006.01)
CPC G01R 31/2818 (2013.01) [H05K 1/0298 (2013.01); H05K 3/103 (2013.01); H05K 3/321 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A hybrid circuit board comprising:
a plurality of board layers comprising a plurality of conductive layers respectively separated by a plurality of insulating layers, wherein the plurality of board layers comprises a surface layer and digital circuitry is at least partially disposed at the surface layer;
a plurality of board pockets recessed within the plurality of board layers, wherein a board pocket comprises a floor at a first intermediate board layer of the plurality of board layers; and
one or more electrical pocket devices disposed on the floor of the board pocket, wherein the one or more electrical pocket devices comprise radio frequency (RF) circuitry that is at least partially disposed within the board pocket and electrically coupled to an intermediate board layer between the first intermediate board layer and the surface layer.