US 12,281,724 B2
Method for manufacturing a micromechanical device and micromechanical valve
Henry Leistner, Munich (DE); Martin Richter, Munich (DE); Martin Wackerle, Munich (DE); and Juergen Kruckow, Munich (DE)
Assigned to Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., Munich (DE)
Filed by Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., Munich (DE)
Filed on Nov. 29, 2021, as Appl. No. 17/536,975.
Application 17/536,975 is a continuation of application No. PCT/EP2020/065067, filed on May 29, 2020.
Claims priority of application No. 102019208023.5 (DE), filed on May 31, 2019.
Prior Publication US 2022/0082181 A1, Mar. 17, 2022
Int. Cl. F16K 99/00 (2006.01); F04B 43/04 (2006.01)
CPC F16K 99/0015 (2013.01) [F16K 99/0057 (2013.01); F04B 43/046 (2013.01); F16K 99/0007 (2013.01); F16K 99/0048 (2013.01); F16K 2099/0074 (2013.01); F16K 2099/008 (2013.01); F16K 2099/0094 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A method for manufacturing at least one micromechanical device, comprising:
providing a first substrate and a separate second substrate, the first substrate comprising two surfaces spaced parallel to each other with a predetermined thickness, and the second substrate comprising two surfaces spaced parallel to each other with a predetermined thickness;
patterning a first trench structure into one of the two surfaces of the first substrate, and patterning a second trench structure into one of the two surfaces of the second substrate;
arranging the patterned surfaces of the two substrates with respect to each other such that a substrate stack with an upper surface and a lower surface is defined, and such that the first and/or second trench structure forms at least one cavity in the substrate stack;
thinning the substrate stack from the upper and/or lower surface of the substrate stack;
exposing the at least one cavity by patterning a recess into the upper and/or lower surface of the substrate stack,
wherein, in the method, exposing the at least one cavity is performed after arranging the two substrates into the substrate stack.