US 12,281,404 B2
Tin-indium alloy electroplating solution
Bhaskar S. Majumdar, Socorro, NM (US); Sherin Bhassyvasantha, Socorro, NM (US); and Luke Soule, Albuquerque, NM (US)
Assigned to NEW MEXICO TECH UNIVERSITY RESEARCH PARK CORPORATION, Socorro, NM (US)
Filed by New Mexico Tech University Research Park Corporation, Socorro, NM (US)
Filed on May 8, 2023, as Appl. No. 18/313,774.
Application 18/313,774 is a continuation of application No. 16/220,883, filed on Dec. 14, 2018, granted, now 11,686,007.
Claims priority of provisional application 62/607,135, filed on Dec. 18, 2017.
Prior Publication US 2023/0383430 A1, Nov. 30, 2023
Int. Cl. C25D 3/56 (2006.01); C23C 18/31 (2006.01); C25D 3/30 (2006.01); C25D 3/32 (2006.01); C25D 3/60 (2006.01); C25D 5/08 (2006.01); C25D 5/34 (2006.01); C25D 17/10 (2006.01); H05K 3/24 (2006.01)
CPC C25D 3/60 (2013.01) [C23C 18/31 (2013.01); C25D 3/30 (2013.01); C25D 3/32 (2013.01); C25D 17/10 (2013.01); H05K 3/24 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A process for electroplating a tin-indium alloy, the process comprising:
(i) preparing an inorganic complexing agent solution in a container;
(ii) adding an inorganic solvent to the container;
(iii) adding an indium solution comprising a source of indium to the container;
(iv) adding an organic complexing agent to the container, wherein the organic complexing agent comprises a nitrogenous complexing agent;
(v) adding a tin solution comprising a source of tin to the container, thereby forming an aqueous electroplating solution;
(vi) contacting an anode, a reference electrode, and a substrate to the aqueous electroplating solution; and
(vii) applying an electrical current to the anode and the substrate, thereby forming the tin-indium alloy on the substrate.