US 12,281,391 B2
Surface conditioner for electroless deposition
Jian Rong Chong, Singapore (SG); and Hirotaka Sato, Singapore (SG)
Assigned to Nanyang Technological University, Singapore (SG)
Appl. No. 18/043,692
Filed by NANYANG TECHNOLOGICAL UNIVERSITY, Singapore (SG)
PCT Filed Sep. 7, 2021, PCT No. PCT/SG2021/050538
§ 371(c)(1), (2) Date Mar. 1, 2023,
PCT Pub. No. WO2022/055426, PCT Pub. Date Mar. 17, 2022.
Claims priority of application No. 10202008720P (SG), filed on Sep. 8, 2020.
Prior Publication US 2023/0265563 A1, Aug. 24, 2023
Int. Cl. C23C 18/00 (2006.01); C23C 18/18 (2006.01)
CPC C23C 18/1893 (2013.01) 18 Claims
OG exemplary drawing
 
1. A composition which conditions a surface for electroless deposition of a metal, the composition comprising:
a polymer surfactant comprising repeating units of a monomer, wherein each of the repeating units comprises a functional group;
a metal ion; and
water,
wherein the functional group in each of the repeating units forms a complex with the metal ion, wherein the metal ion is present in the composition in a range of 0.01 wt % to 0.02 wt %, and wherein the polymer surfactant is present in the composition in a range of 0.1 wt % to 0.5 wt %.