US 12,281,390 B2
Substrate liquid processing apparatus for supplying temperature-controlled plating liquid
Yuichiro Inatomi, Kumamoto (JP); and Tomonori Esaki, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Appl. No. 17/415,887
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Dec. 16, 2019, PCT No. PCT/JP2019/049150
§ 371(c)(1), (2) Date Jun. 18, 2021,
PCT Pub. No. WO2020/137652, PCT Pub. Date Jul. 2, 2020.
Claims priority of application No. 2018-247887 (JP), filed on Dec. 28, 2018.
Prior Publication US 2022/0074052 A1, Mar. 10, 2022
Int. Cl. C23C 18/16 (2006.01); C23C 14/50 (2006.01)
CPC C23C 18/1628 (2013.01) [C23C 18/168 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate liquid processing apparatus configured to supply a plating liquid to a substrate, comprising:
a substrate holder configured to hold the substrate;
a plating liquid sending device configured to send the plating liquid to a first flow path;
a temperature controller connected to the plating liquid sending device via the first flow path and configured to control a temperature of a fluid supplied through the first flow path to a predetermined temperature for plating from a temperature that is not the predetermined temperature for plating;
a pushing fluid sending device configured to send a pushing fluid different from the plating liquid stored in the temperature controller to the first flow path, wherein the first flow path is disposed between the plating liquid sending device and the temperature controller;
a discharge device connected to the temperature controller and configured to discharge a fluid, including the plating liquid or the pushing fluid, supplied from the temperature controller; and
a controller configured to control the plating liquid sending device and the pushing fluid sending device such that a timing of sending the plating liquid from the plating liquid sending device to the first flow path to store the plating liquid in the temperature controller is different from a timing of sending the pushing fluid from the pushing fluid sending device to the first flow path to push the plating liquid stored in the temperature controller by the pushing fluid,
the controller is further configured to control the plating liquid sending device and the pushing fluid sending device to execute:
a) supplying the plating liquid from the plating liquid sending device to the temperature controller through the first flow path; and
b) after a), after the plating liquid has been heated to the predetermined temperature for plating in the temperature controller, pushing the plating liquid in the temperature controller by a sending of the pushing fluid from the pushing fluid sending device to the first flow path,
wherein the substrate includes multiple substrates, and
a) and b) are repeated for every one of the multiple substrates.