US 12,281,377 B2
Copper alloy and method for producing same
Yumiko Kasuya, Handa (JP); and Koki Chiba, Handa (JP)
Assigned to NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK INSULATORS, LTD., Nagoya (JP)
Filed on Mar. 23, 2022, as Appl. No. 17/656,028.
Claims priority of application No. 2021-059496 (JP), filed on Mar. 31, 2021; and application No. 2022-003397 (JP), filed on Jan. 12, 2022.
Prior Publication US 2022/0316029 A1, Oct. 6, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C22C 9/06 (2006.01); C22C 1/02 (2006.01); C22F 1/08 (2006.01)
CPC C22C 9/06 (2013.01) [C22C 1/02 (2013.01); C22F 1/08 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A copper alloy composed of:
Ni: 5 to 25% by weight;
Sn: 5 to 10% by weight;
at least one element M selected from the group consisting of Zr, Ti, Fe, and Si: 0.01 to 0.30% by weight in total;
at least one element A selected from the group consisting of Mn, Zn, Mg, Ca, Al, and P: 0.01 to 1.00% by weight in total;
the balance being Cu and inevitable impurities,
wherein Ni-based intermetallic compound grains comprising a Ni-M intermetallic compound are formed in the copper alloy, and a number of the Ni-based intermetallic compound grains present per unit area of 1 mm2 in the copper alloy is 1.0×103 to 2.0×104,
wherein the number of the Ni-based intermetallic compound grains present per unit area of 1 mm2 is determined using only Ni-based intermetallic compound grains having a grain size of 1.5 to 100 μm, and
wherein the copper alloy has a friction coefficient of 0.4 or less.