US 12,281,243 B2
Method of removing an adhesive for an EUV mask and method of reusing an EUV mask
Byungchul Yoo, Yongin-si (KR); Byunghoon Lee, Osan-si (KR); Myungjun Kim, Osan-si (KR); Jikang Kim, Osan-si (KR); Jeonghwan Min, Osan-si (KR); Kyoungchae Seo, Osan-si (KR); and Changyoung Jeong, Osan-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR); and FINE SEMITECH CORP., Osan-Si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 9, 2022, as Appl. No. 17/884,077.
Application 17/884,077 is a division of application No. 16/801,677, filed on Feb. 26, 2020, abandoned.
Claims priority of application No. 10-2019-0094032 (KR), filed on Aug. 1, 2019.
Prior Publication US 2022/0380643 A1, Dec. 1, 2022
Int. Cl. C09J 163/00 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); G03F 1/22 (2012.01); G03F 1/82 (2012.01)
CPC C09J 163/00 (2013.01) [B08B 3/04 (2013.01); B08B 3/08 (2013.01); G03F 1/22 (2013.01); G03F 1/82 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method of reusing an EUV mask, the method comprising:
i) applying an adhesive on the EUV mask;
ii) attaching a stud on the adhesive;
iii) disposing a frame and a pellicle membrane on the stud;
iv) separating the frame and pellicle membrane from the stud;
v) detaching the stud from the EUV mask; and
vi) removing the adhesive from the EUV mask, wherein:
the adhesive includes an epoxy resin composition in an amount of 50 wt % to 80 wt % and an inorganic filler in an amount of 20 wt % to 50 wt % based on the total weight of the adhesive,
the epoxy resin composition includes an epoxy resin, a hardener, a toughening agent, a filler, and a curing accelerator, and
the inorganic filler includes aluminum hydroxide,
wherein operation vi) includes:
swelling the adhesive by adding water into the adhesive remaining on the EUV mask to form a swollen adhesive, and
removing the swollen adhesive by adding a strong acid to the swollen adhesive.