	US 12,281,195 B2
	Epoxy resin composition, gas barrier film, and laminate
Kazuki Kouno, Kanagawa (JP); and Ryoma Hashimoto, Kanagawa (JP)
Assigned to MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
Appl. No. 17/634,431
Filed by MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
PCT Filed Jul. 13, 2020, PCT No. PCT/JP2020/027176 § 371(c)(1), (2) Date Feb. 10, 2022, PCT Pub. No. WO2021/029170, PCT Pub. Date Feb. 18, 2021.
Claims priority of application No. 2019-148906 (JP), filed on Aug. 14, 2019.
Prior Publication US 2022/0315694 A1, Oct. 6, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C08G 59/50 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); C08G 59/28 (2006.01); C08K 3/22 (2006.01)

CPC C08G 59/5033 (2013.01) [B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); C08G 59/28 (2013.01); C08K 3/22 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/748 (2013.01); C08K 2003/2227 (2013.01)]

14 Claims

1. An epoxy resin composition comprising:

an epoxy resin;

an epoxy resin curing agent comprising an amine-based curing agent; and

at least one acidic compound selected from the group consisting of p-toluenesulfonic acid, dodecylbenzene sulfonic acid, lactic acid, salicylic acid, 2-acrylamido-2-methylpropane sulfonic acid, and phosphoric acid,

wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0 and

wherein the epoxy resin comprises, as a main component, an epoxy resin having a glycidylamino group derived from meta-xylylenediamine.