US 12,281,049 B2
Embedding sensors in 3D-printed silicon carbide
Christian M. Petrie, Oak Ridge, TN (US); Brian C. Jolly, Oak Ridge, TN (US); Kurt A. Terrani, Oak Ridge, TN (US); and Michael P. Trammell, Oak Ridge, TN (US)
Assigned to UT-BATTELLE, LLC, Oak Ridge, TN (US)
Filed by UT-Battelle, LLC, Oak Ridge, TN (US)
Filed on Apr. 19, 2024, as Appl. No. 18/640,294.
Application 18/640,294 is a division of application No. 17/142,315, filed on Jan. 6, 2021, granted, now 11,964,918.
Claims priority of provisional application 62/965,302, filed on Jan. 24, 2020.
Prior Publication US 2024/0279127 A1, Aug. 22, 2024
Int. Cl. G01D 11/24 (2006.01); C04B 35/565 (2006.01); C04B 35/63 (2006.01); C04B 37/02 (2006.01); C04B 37/04 (2006.01)
CPC C04B 37/021 (2013.01) [C04B 35/565 (2013.01); C04B 35/63 (2013.01); C04B 37/042 (2013.01); G01D 11/245 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/6026 (2013.01); C04B 2237/365 (2013.01); C04B 2237/403 (2013.01); C04B 2237/408 (2013.01); C04B 2237/62 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An embedded sensor comprising:
a sensor component; and
a sensor envelope composed of only a silicon carbide matrix, the sensor envelope defining a channel, the channel extending along a path in three dimensions within the sensor envelope and being to the exterior of the sensor envelope,
wherein the sensor component is located in, and extends along the path of, the channel.