US 12,280,978 B2
Component supply device and cover tape peeling method
Yoshinori Isobata, Fukuoka (JP); Kyourei Ri, Fukuoka (JP); and Tatsuo Yamamura, Fukuoka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/754,655
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Oct. 9, 2020, PCT No. PCT/JP2020/038369
§ 371(c)(1), (2) Date Apr. 8, 2022,
PCT Pub. No. WO2021/070954, PCT Pub. Date Apr. 15, 2021.
Claims priority of application No. 2019-188108 (JP), filed on Oct. 11, 2019.
Prior Publication US 2023/0271803 A1, Aug. 31, 2023
Int. Cl. B32B 43/00 (2006.01); B65H 20/22 (2006.01); B65H 35/00 (2006.01); B65H 41/00 (2006.01); H05K 13/02 (2006.01); H05K 13/04 (2006.01)
CPC B65H 41/00 (2013.01) [B32B 43/006 (2013.01); B65H 20/22 (2013.01); B65H 35/0026 (2013.01); H05K 13/02 (2013.01); H05K 13/0419 (2018.08)] 11 Claims
OG exemplary drawing
 
1. A component supply device that supplies a component accommodated in a carrier tape comprising a base tape and a cover tape pasted on the base tape and having a length to a forward end thereof that is longer than that of the base tape, the component supply device comprising:
a tape conveying part that conveys the carrier tape along a conveyance path;
a turning over correcting part that moves the forward end of the cover tape folded to a side opposite to a side of a conveyance direction, to a position located ahead of a forward end of the base tape in the conveyance direction in the conveyance path; and
a peeling part that captures the forward end of the cover tape, the peeling part peeling off the cover tape from the base tape.