| CPC B32B 7/12 (2013.01) [B29C 43/18 (2013.01); B29C 70/003 (2021.05); B29C 70/30 (2013.01); B32B 21/04 (2013.01); B32B 21/042 (2013.01); B32B 21/08 (2013.01); B32B 27/08 (2013.01); B32B 37/02 (2013.01); B32B 37/10 (2013.01); B32B 37/1207 (2013.01); B32B 37/1284 (2013.01); B29K 2063/00 (2013.01); B32B 2250/02 (2013.01); B32B 2260/046 (2013.01); B32B 2307/738 (2013.01); B32B 2307/75 (2013.01); B32B 2363/00 (2013.01); B32B 2479/00 (2013.01); B32B 2605/00 (2013.01); B32B 2605/18 (2013.01); F41H 1/08 (2013.01); F41H 5/08 (2013.01)] | 20 Claims |
|
1. A method comprising:
(i) forming a substantially planar composite structure having at least two layers;
(ii) applying a reformable epoxy resin adhesive material onto one or more of the at least two layers;
(iii) optionally cutting the composite structure to a desired shape;
(iv) heating the substantially planar composite structure in a mold to form a non-planar composite structure;
wherein
the reformable epoxy resin adhesive material falls below its glass transition temperature upon exposure to ambient temperature;
after the reformable epoxy resin adhesive material falls below its glass transition temperature, it can be heated multiple times above its glass transition temperature for molding into the non-planar composite structure; and
at least one of the at least two layers is a wood material.
|