US 12,280,578 B2
Method for repairing electrostatic chuck device
Keisuke Maeda, Tokyo (JP); and Yuuki Kinpara, Tokyo (JP)
Assigned to SUMITOMO OSAKA CEMENT CO., LTD., Tokyo (JP)
Appl. No. 18/022,268
Filed by SUMITOMO OSAKA CEMENT CO., LTD., Tokyo (JP)
PCT Filed Aug. 30, 2021, PCT No. PCT/JP2021/031729
§ 371(c)(1), (2) Date Feb. 20, 2023,
PCT Pub. No. WO2022/070721, PCT Pub. Date Apr. 7, 2022.
Claims priority of application No. 2020-164776 (JP), filed on Sep. 30, 2020.
Prior Publication US 2023/0321968 A1, Oct. 12, 2023
Int. Cl. B32B 37/12 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); H01L 21/683 (2006.01)
CPC B32B 37/12 (2013.01) [B32B 7/12 (2013.01); B32B 9/041 (2013.01); B32B 2255/26 (2013.01); B32B 2307/304 (2013.01); B32B 2307/54 (2013.01); B32B 2309/02 (2013.01); B32B 2311/00 (2013.01); B32B 2315/02 (2013.01); B32B 2457/00 (2013.01); H01L 21/6833 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for repairing an electrostatic chuck device in which an electrostatic chuck member made of ceramics and a temperature-controlling base member made of metal are bonded together by a first adhesive layer formed from a thermosetting adhesive having a thermosetting temperature of 70° C. to 140° C. sandwiched therebetween, the method comprising:
a step of repairing the first adhesive layer that has been eroded by using a cold-curing adhesive having a curing temperature of 0° C. or higher and 60° C. or lower.