US 12,280,577 B2
Bonding device
Biwu Liu, Hubei (CN)
Assigned to WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Hubei (CN)
Filed by WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Hubei (CN)
Filed on Aug. 30, 2023, as Appl. No. 18/458,836.
Claims priority of application No. 202211392320.7 (CN), filed on Nov. 8, 2022.
Prior Publication US 2024/0149579 A1, May 9, 2024
Int. Cl. B32B 37/10 (2006.01); B32B 37/00 (2006.01)
CPC B32B 37/1045 (2013.01) [B32B 37/0046 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A bonding device, comprising:
a main body; and
a lamination part connected to the main body and configured to press and bond an adhesive layer to an apparatus to be bonded;
wherein the lamination part comprises a lamination main portion and a squeeze sub-portion connected to the lamination main portion, and along a lamination direction perpendicular to the lamination part, and a width of the squeeze sub-portion is less than a width of the lamination main portion;
wherein the squeeze sub-portion comprises a flexible body and a connector connecting the flexible body and the lamination main portion, and the flexible body is disposed around an end of a side of the connector away from the lamination main portion; and an elastic modulus of the flexible body is less than an elastic modulus of the connector;
wherein an outer surface of a side of the flexible body away from the connector is a spherical surface.