US 12,280,556 B2
Assembly of flexible optical waveguides and photonic chips for optical interconnection packaging
Linan Jiang, Tucson, AZ (US); Stanley K. H. Pau, Tucson, AZ (US); Robert A. Norwood, Tucson, AZ (US); and Thomas L. Koch, Tucson, AZ (US)
Assigned to Arizona Board of Regents on Behalf of the University of Arizona, Tucson, AZ (US)
Appl. No. 17/423,893
Filed by Arizona Board of Regents on Behalf of the University of Arizona, Tucson, AZ (US)
PCT Filed Jan. 17, 2020, PCT No. PCT/US2020/014031
§ 371(c)(1), (2) Date Jul. 18, 2021,
PCT Pub. No. WO2020/150572, PCT Pub. Date Jul. 23, 2020.
Claims priority of provisional application 62/793,964, filed on Jan. 18, 2019.
Prior Publication US 2022/0105695 A1, Apr. 7, 2022
Int. Cl. B29D 11/00 (2006.01); G02B 6/42 (2006.01)
CPC B29D 11/0075 (2013.01) [G02B 6/4239 (2013.01)] 36 Claims
OG exemplary drawing
 
1. A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board (OPCB), comprising:
applying a coupling agent to a bonding surface of a flexible, freestanding polymer waveguide array film having at least one polymer waveguide disposed therein;
placing the waveguide array film onto the first and second photonic chips so that the waveguide array film extends over a gap and/or a step between the first and second photonic chips to thereby form a bonding interface between the bonding surface of the waveguide array film and the first and second photonic chips, the coupling agent being selected such that optical coupling between the first and second photonic chips arises simultaneously with formation of the bonding interface.