US 12,280,551 B2
Deep lead heat staking device and method
Alex Spurgeon, Grove City, OH (US)
Filed by Alex Spurgeon, Grove City, OH (US)
Filed on Jul. 30, 2023, as Appl. No. 18/361,867.
Prior Publication US 2025/0033294 A1, Jan. 30, 2025
Int. Cl. B29C 65/30 (2006.01); B29C 65/00 (2006.01); B29C 65/20 (2006.01); B29C 65/60 (2006.01)
CPC B29C 65/30 (2013.01) [B29C 65/20 (2013.01); B29C 65/606 (2013.01); B29C 66/81422 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A device used in a heat staking system, comprising:
a first lead;
a second lead;
a first deep lead, having an interior surface and an exterior surface;
a second deep lead, having an interior surface and an exterior surface;
the first lead being electrically and mechanically connected to the exterior surface of the first deep lead;
the second deep lead being electrically and mechanically connected to the exterior surface of the second lead;
a forming tip, having an open end, a closed end, an exterior side, and an interior side;
the forming tip having a forming dome, the forming dome further having an exterior side and an interior side;
the first lead, the second lead, the first deep lead, and the second deep lead having higher electrical conductivity than the forming tip;
the first deep lead and the second deep lead being electrically and mechanically connected to opposite sides of the interior of the forming tip;
a first notch on the forming tip, enabling the first deep lead to be connected to the interior of the forming tip;
a second notch on the forming tip, enabling the second deep lead to be connected to the interior of the forming tip;
the first deep lead and the second deep lead further being elongated to extend from the open end of the forming tip towards the closed end of the forming tip, to the interior of the forming dome;
the forming tip providing an electrical short circuit between each the first deep lead and the second deep lead; and
the short circuit producing heat at the forming dome.