US 12,280,466 B2
Substrate polishing apparatus, substrate polishing system including the same, and substrate polishing method using the same
Jaehyug Lee, Hwaseong-si (KR); Chae Lyoung Kim, Hwaseong-si (KR); Hoyoung Kim, Seongnam-si (KR); and Seungjun Lee, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 26, 2022, as Appl. No. 17/825,449.
Claims priority of application No. 10-2021-0142062 (KR), filed on Oct. 22, 2021.
Prior Publication US 2023/0131040 A1, Apr. 27, 2023
Int. Cl. B24B 37/04 (2012.01); B24B 37/07 (2012.01)
CPC B24B 37/046 (2013.01) [B24B 37/042 (2013.01); B24B 37/07 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate polishing apparatus, comprising:
an electric field applying module; and
a platen configured to rotate a polishing pad,
wherein the electric field applying module includes an inner electrode having a circular shape when viewed in plan,
wherein the platen is on the inner electrode,
wherein a central axis of the inner electrode is spaced apart from a central axis of the platen,
wherein the inner electrode includes a first electrode and a second electrode, and
wherein the second electrode surrounds the first electrode and has an annular shape.