US 12,280,453 B2
Processing method of formic acid soldering
Kuo-Liang Yeh, Hsinchu County (TW); Jung-Kuei Peng, Hsinchu County (TW); Ya Ju Chang, Hsinchu County (TW); and Wen-Ting Huang, Hsinchu County (TW)
Assigned to 3S Silicon Tech, Inc., Hsinchu County (TW)
Filed by 3S SILICON TECH, INC., Hsinchu County (TW)
Filed on Aug. 19, 2022, as Appl. No. 17/891,268.
Claims priority of application No. 110146903 (TW), filed on Dec. 15, 2021.
Prior Publication US 2023/0182237 A1, Jun. 15, 2023
Int. Cl. B23K 1/00 (2006.01); B23K 1/015 (2006.01); B23K 1/20 (2006.01); B23K 35/36 (2006.01); B23K 103/08 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); B23K 103/14 (2006.01)
CPC B23K 35/3618 (2013.01) [B23K 1/015 (2013.01); B23K 1/20 (2013.01); B23K 2103/08 (2018.08); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/14 (2018.08)] 9 Claims
OG exemplary drawing
 
1. A processing method of formic acid soldering, comprising:
providing a solder, wherein the solder is disposed at a soldering object;
performing a formic acid providing step, wherein a water-containing formic acid vapor extracted from a formic acid source is introduced to the soldering object so as to form a water-containing formic acid atmosphere surrounding the soldering object;
performing a soldering step, wherein the solder and the soldering object are soldered in the water-containing formic acid atmosphere at a soldering temperature so as to form a soldered object with high temperature;
performing a cooling step, wherein the soldered object with high temperature is cooled by a cooling method so as to form a soldered object;
wherein a range of moisture content of the formic acid source is greater than or equal to 0.1 wt % and less than 15 wt %.