US 12,280,445 B2
Material processing method and material processing system for performing the method
Stephan Hiller, Koenigsbronn-Zang (DE)
Assigned to Carl Zeiss Microscopy GmbH, Jena (DE)
Filed by Carl Zeiss Microscopy GmbH, Jena (DE)
Filed on Dec. 20, 2021, as Appl. No. 17/556,070.
Claims priority of application No. 102020134463.5 (DE), filed on Dec. 21, 2020.
Prior Publication US 2022/0193819 A1, Jun. 23, 2022
Int. Cl. B23K 26/04 (2014.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); B23K 26/082 (2014.01); B23K 26/362 (2014.01); H01J 37/20 (2006.01); H01J 37/22 (2006.01); H01L 21/268 (2006.01); H01L 21/67 (2006.01); H01L 23/544 (2006.01); B23K 101/36 (2006.01); H01J 37/28 (2006.01)
CPC B23K 26/04 (2013.01) [B23K 26/032 (2013.01); B23K 26/082 (2015.10); B23K 26/083 (2013.01); B23K 26/362 (2013.01); H01J 37/20 (2013.01); H01J 37/222 (2013.01); H01L 21/268 (2013.01); H01L 21/67282 (2013.01); H01L 23/544 (2013.01); B23K 2101/36 (2018.08); H01J 37/28 (2013.01); H01L 2223/54426 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of using a material processing system which comprises a particle beam column configured to direct a particle beam at a first processing region and a laser scanner configured to direct a laser beam at a second processing region, the method comprising:
scanning a first mark placed on an object with the particle beam;
scanning the first mark with the laser beam a first time and producing a second mark on the object with the laser beam;
scanning the second mark with the particle beam; and
scanning the first mark with the laser beam a second time and removing material of the object with the laser beam based on the scanning of the second mark with the particle beam.